TUNGSTEN TARGET
Nā waihona huahana
Hua waihona | TUNGSTEN (W) SPUTTERING TARGETING |
Kumu | W1 |
Loaʻa i ka hoʻomaʻemaʻe (%) | 99.5%, 99.8%, 99.9%, 99.95%, 99.99% |
Shape: | Papaʻi, wahi, apu, paila |
Kaoaohai | Ke koi nei nā mea kūʻai aku |
Kū-starder | Awa b760-07, GB / T 3875-06 |
Huakai | ≥19.3g / cm3 |
Malting Point | 3410 ° C |
Ka leo atomic | 9.53 cm3 / mol |
Ke kūlike o keʻano o ke kūʻana | 0.00482 I / ℃ |
Wela | 847.8 kj / Mol (25 ℃) |
ʻO ka wela o ka wela | 40.13 ± 6.67KJ / mol |
Moku'āina | Plangar tungsten target, huli i ka pahuhopu tungsten target, pōʻai nui |
Moku wahi | Polish a alkali holoi holoi |
Huakaikahi | TUNGSTEN BILLET (ROW MERETER) |
ʻO ka mea i pīhoihoi a me ka mea i hoʻowalewaleʻia i nā hiʻohiʻona o ka nui o 99% a iʻole ke kiʻekiʻe o ka constality, he 5pmm a iʻole ka liʻiliʻi o ka defalgen. Ua hoʻomaikaʻiʻo ia i ka hanaʻana o ka hana metala unprocessed e hoʻomaikaʻi i ka mea hiki ke hoʻomaikaʻi i ka hopena o ke kumu kūʻai. He kiʻekiʻe loa ka target turadten Target i kahi kiʻekiʻe kiʻekiʻe, he kiʻekiʻe kiʻekiʻe loa i hiki ke hoʻokōʻia e nā palena kuʻina, a hoʻomaikaʻi nui ia ka mea kiko'ī.
Pono
(1)ʻO ka maka maikaʻiʻole me kaʻole o ka pore, scratch a me nā mea'ē aʻe
(2) ke kālaiʻana a iʻole ka'ā'īʻana,ʻaʻoheʻoki i nā hōʻailona
(3) unbeatable unbatable o ka mea maʻemaʻe
(4) mau lōʻihi kiʻekiʻe
(5) Homogeneous Trucalture
(6) Laser hōʻailona no kāu mea kūikawā me ka inoa inoa, Brand, Brain
(7)ʻO nā PC o nā posters e hoʻopili ana i nā mea e pili ana i nā mea āpau
Hiki i kēlā mau hana āpau ke hoʻohiki iāʻoe i hoʻokahi manawa i hanaʻia a iʻole keʻano o keʻano hou, hiki ke kopeʻia e kākoʻo i kahi huahana maikaʻi.
ʻO nā hemahema'ē aʻe
Nā lako kiʻekiʻe
(1) 100% density = 19.35 g / cm³
(2) kūlike
(3) hoʻonui i nā waiwai hana
(4) Uniform Grain i ka hoʻokaʻawaleʻana
(5) mau'āpana liʻiliʻi liʻiliʻi
Hoʻokani
Hoʻohana nuiʻia nā kumuhana koʻikoʻi ma Aerospace, Raer ka Honua, Nā Kūlana Checkning, Lunapapa a me nā holoholona'ē aʻe a me nā holoholona'ē aʻe a me nā holoholona'ē aʻe.